Characteristics:
RMA-218 is a high viscosity no-clean flux that can be used for touch-up, sphere or pin attachment to BGA, CGA and CSP packages.
It has less residue, good tinning, bright solder point and less smoke, you can rest assured to use it.
Widely used for moderate activity of rosin flux paste, phone card computer graphics card rework SMD.
Hood quality. Flux paste can stick more firmly.
RMA-218 flux and needle only, other accessories demonstration in the picture is not included.
Specification:
Model: RMA-218
Material: plastic + solder paste
Color: as the picture
Volume: 10CC
